Resume

Rick Sturdivant

Education

Ph.D. (Systems Engineering) Colorado State University
M.A. (Science and Religion) Biola University
M.S. (Electrical Engineering) University of California at Los Angeles
B.S. (Electrical Engineering) California State University at Long Beach
B.A. (Religion) Vanguard University

Summary

Dr. Sturdivant has extensive experience in engineering and management of all aspects of product development for microwave and millimeter-wave systems, modules, integrated circuits, and passives such as filters and couplers. He has specialized training in systems engineering, applied electromagnetics, and general engineering. He is a senior member of the IEEE.

Books

1) K. Kuang, R. Sturdivant, Editors, RF and Microwave Microelectronics Packaging II (New York: Springer Publishing, 2017).

2) R. Sturdivant, M. Harris,Transmit Receive Modules for Communication and Radar Systems (Norwood, MA: Artech House, 2015).

3) R. Sturdivant, A.J. Bogdon, Hands on Guide to Heat Transfer For Microwave and Millimeter-wave Electronics (eBook published by Amazon, 2015).

4) R. Sturdivant, Microwave and Millimeter-wave Electronic Packaging (Norwood, MA: Artech House, 2014).

Book Chapters

1) R. Sturdivant, “Balun Designs for Wireless: Mixers, Amplifiers, and Antennas,” Chapter 6 in Practical Filters and Couplers (Atlanta, GA: Noble Publishing, 2001).

2) R. Sturdivant, “Fundamentals Of Packaging at Microwave and Millimeter-wave Frequencies,” Chapter 1 in RF and Microwave Microelectronics Packaging (New York: Springer Publishing, 2010).

3) R. Sturdivant, “Introduction to Radio Frequency and Microwave Microelectronic Packaging,” Chapter 1 in RF and Microwave Microelectronics Packaging II (New York: Springer Publishing, 2017).

4) R. Sturdivant, “Packaging of Transmit/Receive Modules,” Chapter 2 in RF and Microwave Microelectronics Packaging II (New York: Springer Publishing, 2017).

5) R. Sturdivant, “3D Transitions and Connections,” Chapter 3 in RF and Microwave Microelectronics Packaging II (New York: Springer Publishing, 2017).

Articles, Conference Papers, Workshops, and other Publications

(for links to digital copies see my Articles and Workshops page)

1) R. Sturdivant, “Balun Designs For Wireless … Mixers, Amplifiers and Antennas,” Applied Microwave and Wireless, Summer 1993.

2) R. Sturdivant, “A Capacitively Coupled BPF Design Using a Suspended Substrate Stripline,” Microwave Journal, Nov. 1993, pp 71-74.

3) R. Sturdivant, C. Quan, B. Young, “Using the matrix metal-on-elastomer connector at microwave frequencies,” Presented at 27th International Symposium on Microelectronics, Boston, MA. 1994.

4) R. Sturdivant, T. Theisen, “Heat Dissipating Transmission Lines,” Applied Microwave & Wireless, Spring 1995, pp. 57-63.

5) R. Sturdivant, “Transmission Line Conductor Loss and the Incremental Inductance Rule,” Microwave Journal, Sept. 1995.

6) R. Sturdivant, “Millimeter-wave characterization of several substrate materials for automotive applications,” in Proceedings of the IEEE Electrical Performance of Electronic Packaging Conference, Oct 2-4, 1995, pp. 137-139.

7) R. Sturdivant, “Reducing the effects of the mounting substrate on the performance of GaAs MMIC flip chips,” in Proceedings of the IEEE MTT-S International Symposium Digest, 1995, pp. 1591-1595.

8) Midford, T., Wooldridge, J., Sturdivant, R., “The evolution of packages for monolithic microwave and millimeter-wave circuits,” IEEE Transactions on Antennas and Prop., Vol 43, No. 9, 1995, pp. 983-991.

9) R. Sturdivant, et. al., “Transitions and interconnects using coplanar waveguide and other three conductor transmission lines,” in Proceedings of the IEEE MTT-S International Symposium, May 1996.

10) R. Sturdivant, “Packaging and Filters At Microwave Frequencies,” Presentation at Buenaventura IEEE Section Meeting, March 22, 1996.

11) R. Sturdivant, et. al., “Design and Performance of a High Density 3D Microwave Module,” in Proceedings of the IEEE MTT-S International Symposium, 1997, pp. 501-504.

12) R. Sturdivant, et. al., “Using MMIC flip chips and CVD diamond for improved thermal management of microwave modules,” in Proceedings of the IEEE MTT-S International Symposium, 1997, pp. 505-507.

13) R. Sturdivant, “MCMs, 3D Packaging, Wafer Scale Packaging, Plastic Packaging,” WMA Workshop, Presented at the IEEE MTT-S International Microwave Symposium, Balitimore, MD June 1998.

14) C.P. Schaffer, I.C. Chen, R.L. Sturdivant, et. al., “Commercial CVD diamond films: Material properties and their related effects on microwave characteristics,” Diamond and Related Materials, vol. 7, Feb. 1999, pp. 585-588.

15) R. Sturdivant, ‘Investigation of MMIC flip chips with sealants for improved reliability without hermeticity,’ in Proceedings of the IEEE MTT-S International Symposium, 1996, pp. 239-242.

16) R. Sturdivant, G.E. Ponchack, “Should I choose a ceramic or organic board?” PWB Workshop, Presented at the IEEE International Microwave Symposium, Fort Worth, TX, June 2004.

17) R. Sturdivant, “Ceramic Packaging Issues for Wireless High Power Amplifiers,” WSJ Workshop, Presented at the IEEE International Microwave Symposium, Fort Worth, TX, June 2004.

18) R. Sturdivant, “Millimeter-wave Performance of Alumina High Temperature Cofired Ceramics IC Packages,” Presented at IMAPS 2006 International Conference and Exhibition on Device Packaging, March 20-23, Scottsdate, AZ.

19) R. Sturdivant, “Microwave Performance of Ball Grid Array Packages,” Prsented at IMAPS 2006 International Conference and Exhibition on Device Packaging, March 20-23, Scottsdate, AZ.

20) R. Sturdivant, “Millimeter-wave Radio System In A Package,” Presented at IMAPS Advanced Technology Workshop on RF and Microwave Packaging, Sept. 2008

21) R. Sturdivant, “Design of Transmit/Receive Modules”, Prsented at IMAPS Advanced Technology Workshop on RF and Microwave Packaging, Sept. 2009

22) R. Sturdivant, “The Incompatibility of Emergent and Thomistic Views of the Soul,” Student Paper, Presented at 59th Annual Midwest Regional Evangelical Theological Society Meeting, 2014.

23) R. Sturdivant, “Broadband Electrical Modeling of Transitions and Interconnects Useful for PCB and Co-fired Ceramic Packaging,” Presented at 2014 IMAPS RaMP Conference, San Diego, CA. Winner of best session paper award.

24) R. Sturdivant, “Materials and Transmission Line Measurements Comparing HTCC and Thick Film Alumina,” Presented at 2014 IMAPS RaMP Conference, Diego, CA

25) R. Sturdivant, “How to Successfully Measure and Model Electronic Packages for SI,” Presented at WMJ Workshop, at the IEEE MTT-S International Microwave Symposium, Phoenix, AZ, May 2015.

26) R. Sturdivant, “Electronic Packaging at Microwave and Millimeter-wave Frequencies: Applications, Key Components, and Design Issues”, Presented at IEEE CLASTECH Conference, Los Angeles, 2015.

27) R. Sturdivant, E.K.P. Chong, “Modeling and Simulation of Via Conductor Losses in Co-fired Ceramic Substrates Used In Transmit/Receive Radar Modules,” Presented at the 2016 IMAPS RaMP Conference, San Diego, CA.

28) R. Sturdivant, E.K.P. Chong, “Systems Engineering Of Hybrid Renewable Electric Power,” in Proceedings of the IEEE Green Tech 2016 Conference, Kansas City, MO, April 7-8.

29) R. Sturdivant, E.K.P. Chong, “Systems Engineering Contributions To Digital Receivers For Phased Array Radar,” in Proceedings of the 2016 IEEE International Symposium on Phased Array Systems and Technology, Oct. 18-21, Waltham, MA.

30) R. Sturdivant, A.J. Bogdon, E.K.P. Chong, “A simple closed form solution to single layer heat spreading angle appropriate for microwave hybrid modules,” Journal of Electronics Cooling and Thermal Control, June 2016, no. 6, pp.52-61.

31) R. Sturdivant, E.K.P. Chong, “Systems engineering of low cost AESAs for high volume consumer LEO satellite ground stations,” Presented at Ka and Broadband Communications Conference, Cleveland, OH, Oct. 2016.

32) R. Sturdivant and E. K. P. Chong, “Systems engineering of a terabit elliptic orbit satellite and phased array ground station for IoT connectivity and consumer Internet access,” IEEE Access, Vol. 4, Sept 13, 2016, pp. 9941-9957.

33) R. Sturdivant, L. Miller, E.K.P. Chong, “Systems Engineering Of Digitally Beam Formed Electronically Scanned Phased Arrays for Terabit per Second Satellites,” in Proceedings of the IEEE Topical Workshop On The Internet of Space (IoT), Phoenix, AZ, January 15-18, 2017.

34) R. Sturdivant, E.K.P. Chong, “Dielectric Notch Radiator Antennas with Integrated Filtering For 5G and IoT Access,” in Proceedings of the IEEE Radio and Wireless Symposium, Phoenix, AZ, January 15-18, 2017.

35) R. Sturdivant, E.K.P. Chong, “System Latency Performance of Mechanical and Electronic Scanned Antennas for LEO Ground Stations for IoT and Internet Access,” in Proceedings of the IEEE Topical Workshop On The Internet of Space (IoT), Phoenix, AZ, January 15-18, 2017.

36) R. Sturdivant, A. Bogdon, E.K.P. Chong, “Balancing Thermal and Electrical Packaging Requirements for GaN Microwave and Millimeter-Wave High Power Amplifier Modules,” Journal of Electronics Cooling and Thermal Control, Vol. 7, No. 1, 2017, pp. 1-7.

37) A. Zahnd, M. Stambaugh, D. Jackson, T. Gross, C. Hugi, R. Sturdivant, J. Yeh, S. Sharma, “Modular Pico-Hydro Power System for Remote Himalayan Villages,” Presented at World Renewable Energy Congress XVI, Feb 5-9, 2017.

38) R. Sturdivant, J. Yeh, M. Stambaugh, A. Zahnd, E. K. P. Chong, “Pico-hydro electric power in the Nepal Himalayas,” in Proceedings of the 9th IEEE Annual Green Technologies Conference (IEEE GreenTech 2017), Denver, Colorado, March 29–31, 2017.

39) R. Sturdivant, “Investigation of Team Based Learning For Teaching General Education Astronomy,” Poster Session at Breaking The Boundaries In STEM Education Research Conference, Los Angeles, CA, April 7, 2017

40) R. Sturdivant, “The Reflective Reciprocal Support Model for Integration of Science and Christianity,” Southern California Christians in Science Conference, Riverside, CA, April 8, 2017.

41) R. Sturdivant and E. K. P. Chong, “Systems Engineering Baseline Concept Of A MultiSpectral Drone Detection Solution For Airports,” IEEE Access, Vol. 5, April 25, 2017, pp. 2169-3536.

42) R. Sturdivant and E. K. P. Chong, “The Necessary and Sufficient Conditions for Emergence in Systems Applied To Symbol Emergence in Robots,” IEEE Transactions on Cognitive and Developmental Systems, Vol. PP, No. 99, July 24, 2017.

43) R. Sturdivant and E. K. P. Chong, “Smart base stations for IoT,” presented at Cyber Cycles for the Internet of Things (IoT), workshop at 1st IEEE Conference on Control Technology and Applications (CCTA), Kohala Coast, Hawai’i, August 27–30, 2017.

44) R. Sturdivant and E. K. P. Chong, “Packageability as an ‘Ility’ for Systems Engineering,” Systems, 5(4), 48, Sept 23, 2017.

45) R. Sturdivant, J. Yeh, M. Stambaugh, A. Zahnd, “Improving the ultilization factor for islanded renewable energy systems,” in Proceedings of the Solar World Congress, Abu Dhabi, UAE, Oct 29-Nov 2, 2017. (to appear)

46) R. Sturdivant, J. Yeh, M. Stambaugh, A. Zahnd, “Sustainability as a characterisitic of renewable energy systems in remote himalayan villages,” in Proceedings of the Solar World Congress, Abu Dhabi, UAE, Oct 29-Nov 2, 2017. (to appear)

47) R. Sturdivant, “Electronic packaging for 5G microwave and millimeter wave systems,” Professional Development Course at IEEE 19th Electronics Packaging Technology Conference, Singapore, Dec 6-9, 2017. (to appear)

48) R. Sturdivant, “Panel Session: Challenge Of 5-G mm-wave Packaging and Opportunity,” Panel Session at IEEE 19th Electronics Packaging Technology Conference, Singapore, Dec 6-9, 2017. (to appear)

49) Rick L. Sturdivant, James Yeh, Mark Stambaugh, Alex Zahnd, Nicholas Villareal, Charles K. Vetter, Justin D. Rohweller, Jacob F. Martinez, Jordan M. Ishii, Ryan A. Brown, Aaron M. Arkie, “IoT enabled pico-hydro electric power with satellite back haul for remote Himalayan villages,” Proceedings of the IEEE Radio and Wireless Conference, Topical Workshop On The Internet of Space, Jan 14-17, 2017, Anaheim, CA. (to appear)

50) R. Sturdivant, R. Brown, J. Sturdivant, “Analysis of big data generated by internet of things (IoT) devices: A smart city sensor application,” 2017 Southern California Big Data Discovery Summit, Azusa, CA, Nov, 4, 2017. (to appear)

Thesis and Dissertation

1) R. Sturdivant, “A Wide Band, Low Loss, Miniature Microwave Diplexer,” M.S. Thesis, Department of Electrical Engineering, Univeristy of California at Los Angeles, Los Angeles, CA, 1992.

2) R. Sturdivant, “Application Of Systems Engineering To Complex Systems and Systems of Systems,” Ph.D. Dissertation, College of Engineering, Colorado State University, 2017.

Awarded Patents

5,886,587 Flipped lumped element circulator
5,691,566 Tapered three-wire line vertical connections
5,689,216 Direct three-wire to stripline connection
5,675,302 Microwave compression interconnect using dielectric filled three-wire line…
5,552,752 Microwave vertical interconnect through circuit with compressible conductor
8,594,638 Dynamic wireless networks and interactive wireless information communication …
9,277,643 S-shaped ceramic feedthrough

Summary of Professional Experience

California Polytechnic University, Pomona, 2017-Present, Job Title: Lecturer
• Department of Electrical and Computer Engineering
• Taught Master of Science capstone engineering application laboratory
Azusa Pacific University, 2016-Present, Job Title: Assistant Professor
• Department of Engineering and Computer Science
• Engineering courses (Statics, Electric Circuits, Intro To Engineering)
• Research in renewable energy, systems engineering, and wireless systems
MPT, Inc. 2003-Present, Job Title: Founder & President
• Boot strapped MPT from zero income into a multi-million dollar a year company
• Designed SiGe low noise amplifiers, switches and phase shifters
• Designed world’s highest power, GaN based high power amplifier module (6-18GHz)
• Developed 11 different MMICs from 4-44GHz including LNA, HPA, Phase Shifters, etc
• Developed packages for ICs from .5 to 40GHz
• Developed T/R modules for phased array radar using surface mount (SMT) techniques
Multilink Technology, Inc. 2000-2003, Job Title: Technical Product Manager
• Helped grow Multilink to its successful Initial Public Offering (IPO)
• Designed high linearity driver and HPA MMIC with 30KHz to 20GHz BW
• Product development lead for new products which resulted in $33M income per year
• Developed world’s first BGA surface mount 12.5Gb/S Modulator Driver product
• Designed lumped element and distributed filters for duo-binary systems
Raytheon (Hughes Aircraft Company) 1989-2000, Job Title: Senior Staff Engineer
• Designed MMIC amplifiers, phase shifters, low noise amplifiers and switches
• Designed T/R modules for airborne radar applications at X-Band
• Design MMIC doubler (12GHz), tripler (33GHz), and LNA (40GHz) for point to point
• Developed world’s first tile array module, received Engineering Excellence Award

Other Professional Experience

Dr. Sturdivant is a recognized expert in the field of T/R modules, phased arrays, and electronic packaging. He is a member and past chair of the IEEE MTT-12 Technical Subcommittee on microwave and millimeter-wave packaging. He is also one of the speaker bureau lecturers for that committee. He has been an invited speaker to IEEE local chapters such as the local MTT-S chapter in San Diego, CA and the joint MTT-S and AP-S in Baltimore, MD.

List of Accomplishments

Senior Member of IEEE
IEEE MTT-S Speakers Bureau 2011-2016
Invited Speaker: IEEE MTT-S, APS Baltimore Section, 2009
Invited Speaker: IMAPS San Diego Chapter, November 15, 2011
Invited Speaker: IEEE MTT-S Buena Ventura Section, March 1996 and March 2013
Invited Speaker: Georgia Tech Professional Education, 2011, 2012, 2013
Invited Speaker: IEEE CLASTECH Symposium, 2015.

Recipient of Hughes Aircraft Microwave Masters Fellowship For M.S. Degree at UCLA
Awarded Hughes Aircraft Engineering Excellence (Engineer of the Year) Award
Guest Editor: IEEE Transaction Microwave Theory and Techniques, Vol. 45, No. 10, 1997
Member IEEE MTT-S MTT-12 Technical Subcommittee on Packaging and Manufacturing
Past Chair IEEE MTT-S MTT-12 Technical Subcommittee on Packaging and Manufacturing
Workshop Organizer: PWB Session, IEEE Int. Microwave Sym. 2004
Workshop Organizer: WSC Session, IEEE Int. Microwave Sym. 1998
Member Steering Committee, IEEE International Microwave Symposium, San Diego, 1994
Technical Reviewer (TPC) for IEEE International Microwave Conference
Technical Reviewer for IEEE Asia Pacific Microwave Conference 2016

Principal Investigator, MDA SBIR Pahse II, HQ0147-17-C-7302, Digital Recievers, 2016
Principal Investigator, Army SBIR Phase III, W911W6-14-C-0014, Low Cost Radar, 2014
Principal Investigator, Navy SBIR Phase II, N00024-13-C-4524, GaN Limiters, 2013
Principal Investigator, Army SBIR Phase II, W31P4Q-13-C-0021, Low Cost Radar, 2013
Principal Investigator, Army SBIR Phase I, W31P4Q-12-C-0011, Low Cost Radar, 2012
Principal Investigator, Navy SBIR Phase I, N00167-11-P-0382, GaN Limiters, 2011
Principal Investigator, Navy SBIR Phase II, N68335-10-C-0050, W-Band Amplifier, 2010
Principal Investigator, Navy SBIR Phase I, N68335-08-C-0467, W-Band Amplifier, 2008
Principal Investigator, MDA SBIR Phase II, HQ0006-06-C-7324, Innovative Radar, 2006
Principal Investigator, Air Force SBIR Phase II, FA9453-05-M-0085, ESA T/R Module, 2005
Principal Investigator, MDA SBIR Phase I, HQ0006-05-C-7189, Manufacturing, 2005
Principal Investigator, MDA SBIR Phase I, N00164-04-C-6039, Power Amplifier, 2004
Principal Investigator, MDA SBIR Phase I, W9113M-04-P-0048, Innovative Radar, 2004
Generated $9.73M in Small Business Innovation Research Grants (SBIR)

Founder & CEO: MPT, Inc.
Founder & CTO: RLS Design, Inc.
Co-Founder, CHO, past board member: iViu Technologies, Inc.
Co-Founder, CTO, past board member: Torrey Pines Technologies Group, LLC
Co-Founder, CTO, past board member: Centric Technologies, Inc.
Co-Founder, CEO, past board member: MMICMAN, LLC
Board of Advisors (2015-Present): Integra Devices, LLC