Books

Editors: Ken Kuang, Rick Sturdivant
Publisher: Springer Publishing, New York, NY
Published: 2017

This book presents the latest developments in packaging for high-frequency electronics. It is a companion volume to “RF and Microwave Microelectronics Packaging” (2010) and covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods, and other RF and microwave packaging topics. Chapters provide detailed coverage of phased arrays, T/R modules, 3D transitions, high thermal conductivity materials, carbon nanotubes and graphene advanced materials, and chip size packaging for RF MEMS. It appeals to practicing engineers in the electronic packaging and high-frequency electronics domain, and to academic researchers interested in understanding the leading issues in the commercial sector. It is also a good reference and self-studying guide for students seeking future employment in consumer electronics.

Rick is co-editor of this book and authored three chapters in it.

Hard Cover Book Available on Amazon.com

Authors: Rick Sturdivant, Mike Harris
Publisher: Artech House, Norwood, MA
Published: 2015

The use of electronically scanned phased arrays is increasing in systems such as radar, wireless networks, and satellite ground terminals. An important and necessary component for these systems is the transmit receive (T/R) module, which provides the amplification and electronic beam steering that is required for proper function. This new resource presents a comprehensive overview of all design, fabrication, integration, and implementation issues associated with T/R modules for radar and communications.
This book provides engineers and researchers with practical designs and 44 examples of analysis, circuits, and components used in T/R modules. It also provides a solid explanation of the theory for how T/R modules operate and how they can be optimized. In addition, this book shows how the latest technical advances in silicon germanium (SiGe) and gallium nitride (GaN) are allowing levels of performance that were previously unachievable. The book concludes with informative chapters on testing, cost considerations, and the future of next generation T/R modules.

Hard Cover Book Available on Amazon.com

Book Recommendation:
“Transmit Receive Modules for Radar and Communication Systems is a rare compilation of all key aspects needed to design and implement T/R modules, covering systems requirements, functional design, MMIC development, packaging and materials selection, layout rules, manufacturing considerations, testing, and cost. It can serve as both a textbook and as a reference guide. Because it presents a complete picture, it is useful to the beginner as a guide, to the expert RF designer as a reference for system requirements, and the systems engineer as a reference for T/R module specifications and requirements for implementation. It also provides a history of T/R module development, gives a complete evaluation of current state of the art, and discusses recent innovations that promise to reduce cost and improve performance. As T/R modules are the key components for implementation of Active Electronic Scanned Arrays, it should be on the bookshelf of anyone employing this technology in Radar, Communications, and EW systems.”
Thomas W Miller, PhD, Consultant, Thales Raytheon Systems

Author: Rick Sturdivant
Publisher: Artech House, Norwood, MA
Published: 2014

Packaging of electronic components at microwave and millimeter-wave frequencies requires the same level of engineering effort for lower frequency electronics plus a set of additional activities which are unique due to the higher frequency of operation. This resource presents you with the electronic packaging issues unique to microwave and millimeter-wave frequencies and reviews lower frequency packaging techniques so they can be adapted to higher frequency designs. You are provided with 30 practical examples throughout the book, as well as three free downloadable software analysis programs.

Hard Cover Book Available on Amazon.com

Download a sample chapter

Authors: Rick Sturdivant and AJ Bogdon
Publisher: Amazon.com
Published: 2015

This hands-on booklet is packed full of practical examples of how to perform heat transfer analysis. It guides the reader from fundamental principles to detailed knowledge that can be applied immediately. The know-how contained in this booklet will be useful to both the beginner and the experienced thermal analyst since it has the right details necessary. The authors are practicing engineers with first-hand experience designing and analyzing electronics for heat transfer.

Kindle Book: Available on Amazon.com

Editors:Ken Kuang, Franklin Kim, Sean S. Cahill
Publisher: Springer Publishing, New York, NY
Published: 2010

This book presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields.

Rick Sturdivant authored Chapter 1 of this book.
Chapter Title: “Fundamentals Of Packaging at Microwave and Millimeter-wave Frequencies”

Hard Cover Book Available on Amazon.com

Editors: Staff Editors at Applied Microwvae & Wireless Magazine
Publisher: Noble Publishing, Atlanta, GA
Published: 2001

This is the first volume of a two volume set containing the most innovative articles on filter design published in Applied Microwave & Wireless magazine between 1989 and 2001. More than 20 experts discuss the latest design and testing techniques for filters, couplers and baluns.

Rick Sturdivant is the author of Chapter 6 in this book.
Chapter Title: “Balun Designs for Wireless: Mixers, Amplifiers, and Antennas”

Book is Out Of Print