Publications

Publications and Conference Presentations

[1] R. Sturdivant, “A Capacitively Coupled BPF Design Using a Suspended Substrate Stripline,” Microwave Journal, Nov. 1993, pp 71-74.

[2] R. Sturdivant, “Balun Designs for Wireless – Mixers, Amplifiers and Antennas,” Applied Microwave and Wireless, Summer 1993.

[3] R. Sturdivant, C. Quan, B. Young, “Using the matrix metal-on-elastomer connector at microwave frequencies.” in Proceedings of the International Symposium on Microelectronics, 27 th, Boston, MA. 1994.

[4] R. Sturdivant, “Transmission line conductor loss and the incremental inductance rule,” Microwave Journal, Sept. 1995. (the copy I have of this article is very low quality so I included a copy of my original submission to the publisher which has better graphical quality though there are differences in the text due to editorial changes)

[5] R. Sturdivant, et. al., “Heat Dissipating Transmission Lines,” Applied Microwave & Wireless, Spring 1995, pp. 57-63.

[6] R. Sturdivant, “Millimeter-wave characterization of several substrate materials for automotive applications,” in Proceedings of the IEEEE Electrical Performance of Electronic Packaging, 1995, pp. 137-139.

[7] R. Sturdivant, “Reducing the effects of the mounting substrate on the performance of GaAs MMIC flip chips,” in Proceedings of the IEEE MTT-S International Microwave Symposium Digest, 1995, pp. 1591-1595.

[8] R. Sturdivant, T.A Midford, J.J. Wooldridge, “The evolution of packages for monolithic microwave and millimeter-wave circuits,” IEEE Transactions on Antennas and Propagation, Sept, 1995, pp. 983-991.

[9] R. Sturdivant, et. al., “Investigation of MMIC flip chips with sealants for improved reliability without hermeticity,” in Proceedings of the IEEE MTT-S International Microwave Symposium Digest, 1996, pp. 239-242.

[10] R. Sturdivant,, et. al., “Transitions and interconnects using coplanar waveguide and other three conductor transmission lines,” in Proceedings of the IEEE MTT-S International Microwave Symposium Digest, 1996, pp. 235-238.

[11] R. Sturdivant, “Packaging and Filters At Microwave Frequencies,” Presented at Buenaventura IEEE Section Meeting, March 22, 1996.

[12] R. Sturdivant, et. al., “Using MMIC flip chips and CVD diamond for improved thermal management of microwave modules,” in Proceedings of the IEEE MTT-S International Microwave Symposium Digest, 1997, pp. 505-507.

[13] R. Sturdivant, et. al., “Design and performance of a high density 3D microwave module,” in Proceedings of the IEEE MTT-S International Microwave Symposium Digest, 1997, pp. 501-504.

[14] C.P. Schaffer, I.C. Chen, R. Sturdivant, A.T. Hunter, R.G. Wilson, “Commercial CVD diamond films: Material properties and their related effects on microwave characteristics,” Diamond and Related Materials, vol. 7, Feb. 1998, pp. 585-588.

[15] R. Sturdivant, “Ceramic Packaging Issues for Wireless High Power Amplifiers,” Presented at WSJ Workshop at IEEE International Microwave Symposium, Fort Worth, TX, June 2004.

[16] R. Sturdivant, “Leadless Chip Carrier for Microwave MEMS Packaging,” in Proceedings of the IMAPS 2006 International Conference and Exhibition on Device Packaging.

[17] R. Sturdivant, “Ceramic Microwave/Millimeter-Wave IC Packaging,” in Proceedings of the IMAPS 2006 International Conference and Exhibition on Device Packaging.

[18] R. Sturdivant, “Millimeter-wave Radio System In A Package,” Presented at IMAPS Advanced Technology Workshop on RF and Microwave Packaging, Sept. 2008.

[19] R. Sturdivant, “Design of Transmit/Receive Modules,” Presented at IMAPS Advanced Technology Workshop on RF and Microwave Packaging, Sept. 2009

[20] R. Sturdivant, “Advanced Packaging,” Presentation at Georgia Tech Research Institute Professional Education, Sept. 2012.

[21] R. Sturdivant,, “Module Packaging,” Presentation at Georgia Tech Research Institute Professional Education, Sept. 2012.

[22] R. Sturdivant, “The Incompatibility of Emergent and Thomistic Views of the Soul,” (Student Paper) Presented at 59th Annual Midwest Regional Evangelical Theological Society Meeting, 2014.

[23] R. Sturdivant, “Materials and Transmission Line Measurements Comparing HTCC and Thick Film Alumina,” in Proceedings of the IMAPS RaMP Conference, San Diego, CA 2014.

[24] R. Sturdivant, “Broadband Electrical Modeling of Transitions and Interconnects Useful for PCB and Co-fired Ceramic Packaging,” in Proceedings of the IMAPS RaMP Conference, San Diego, CA 2014. (Won best session paper)

[25] R. Sturdivant, “How to Successfully Measure and Model Electronic Packages for SI,” Presented at WMJ Workshop at IEEE MTT-S International Microwave Symposium, Phoenix, AZ, May 2015.

[26] R. Sturdivant, “Electronic Packaging at Microwave and Millimeter-wave Frequencies: Applications, Key Components, Design Issues,” Presented at IEEE CLASTECH Conference, Los Angeles, CA, November 2015.

[27] R. Sturdivant, E.K.P. Chong, “Modeling and Simulation of Via Conductor Losses in Co-fired Ceramic Substrates Used In Transmit Receive Radar Modules,” Presented at IMAPS RaMP Conference, San Diego, CA.

[28] R. Sturdivant, E.K.P. Chong, “Systems engineering of hybrid renewable electric power,” in Proceedings of the IEEE Green Technologies Conference (GreenTech), Kansas City, MO, April 2016.

[29] R. Sturdivant, A.J. Bogdon, E.K.P. Chong, “A simple closed form solution to single layer heat spreading angle appropriate for microwave hybrid modules,” Journal of Electronics Cooling and Thermal Control, June 2016, no. 6, pp.52-61.

[30] R. Sturdivant and E. K. P. Chong, “Systems engineering of a terabit elliptic orbit satellite and phased array ground station for IoT connectivity and consumer Internet access,” IEEE Access, Vol. 4, Sept 13, 2016, pp. 9941-9957.

[31] R. Sturdivant, E.K.P. Chong, “Systems engineering contributions to digital receivers for phased array radar,” in Proceedings of the IEEE International Symposium on Phased Array Systems and Technology, Waltham, MA, Oct. 2016.

[32] R. Sturdivant, E.K.P. Chong, “Systems engineering of low cost AESAs for high volume consumer LEO satellite ground stations,” in Proceedings of the Ka and Broadband Communications Conference, Cleveland, OH, Oct. 2016.

[33] R. Sturdivant, L. Miller, E.K.P. Chong, “Systems Engineering Of Digitally Beam Formed Electronically Scanned Phased Arrays for Terabit per Second Satellites,” in Proceedings of the Topical Workshop on Internet of Space (TWIOS), Phoenix, AZ, January 15-18, 2017.

[34] R. Sturdivant, E.K.P. Chong, “Dielectric Notch Radiator Antennas with Integrated Filtering For 5G and IoT Access,” in Proceedings of the IEEE Radio and Wireless Symposium, Phoenix, AZ, January 15-18, 2017.

[35] R. Sturdivant, E.K.P. Chong, “System Latency Performance of Mechanical and Electronic Scanned Antennas for LEO Ground Stations for IoT and Internet Access,” in Proceedings of Topical Workshop on Internet of Space (TWIOS), Phoenix, AZ, January 15-18, 2017.

[36] A. Zahnd, M. Stambaugh, D. Jackson, T. Gross, C. Hugi, R. Sturdivant, J. Yeh, S. Sharma, “Modular Pico-Hydro Power System for Remote Himalayan Villages,” Presented at World Renewable Energy Congress XVI, Feb 5-9, 2017.

[37] R. Sturdivant, J. Yeh, M. Stambaugh, A. Zahnd, E. K. P. Chong, “Pico-hydro electric power in the Nepal Himalayas,” in Proceedings of the 9th IEEE Annual Green Technologies Conference (IEEE GreenTech 2017), Denver, Colorado, March 29–31, 2017.

[38] R. Sturdivant, “Investigation of Team Based Learning For Teaching General Education Astronomy,” Poster Session at Breaking The Boundaries In STEM Education Research Conference, Los Angeles, CA, April 7, 2017

[39] R. Sturdivant, “The Reflective Reciprocal Support Model for Integration of Science and Christianity,” Presented at 2017 Annual Day Conference—So. Cal. Christians in Science, Riverside, CA, April 8, 2017.

[40] R. Sturdivant, E.K.P. Chong, “Systems Engineering Baseline Concept Of A MultiSpectral Drone Detection Solution For Airports,” IEEE Access, Vol. 5, April 25, 2017, pp. 2169-3536.

[41] R. Sturdivant and E. K. P. Chong, “The Necessary and Sufficient Conditions for Emergence in Systems Applied To Symbol Emergence in Robots,” IEEE Transactions on Cognitive and Developmental Systems, July 24, 2017.

[42] R. Sturdivant, A. Bogdon, E.K.P. Chong, “Balancing Thermal and Electrical Packaging Requirements for GaN Microwave and Millimeter-Wave High Power Amplifier Modules” Journal of Electronics Cooling and Thermal Control, Vol. 7, No. 1, 2017, pp. 1-7.

[43] R. Sturdivant and E. K. P. Chong, “Smart base stations for IoT,” Presented at Cyber Cycles for the Internet of Things (IoT), workshop at 1st IEEE Conference on Control Technology and Applications (CCTA), Kohala Coast, Hawai’i, August 27–30, 2017.

[44] R. Sturdivant and E. K. P. Chong, “Packageability as an ‘Ility’ for Systems Engineering,” Systems, 5(4), 48, Sept 23, 2017.

[45] R. Sturdivant, J. Yeh, M. Stambaugh, A. Zahnd, “Sustainability as a characterisitic of renewable energy systems in remote himalayan villages,” in Proceedings of the Solar World Congress, Abu Dhabi, UAE, Oct 29-Nov 2, 2017.

[46] R. Sturdivant, J. Yeh, M. Stambaugh, A. Zahnd, “Improving the ultilization factor for islanded renewable energy systems,” in Proceedings of the Solar World Congress, Abu Dhabi, UAE, Oct 29-Nov 2, 2017.

[47] R. Sturdivant, R. Brown, J. Sturdivant, “Analysis of big data generated by internet of things (IoT) devices: A smart city sensor application,” Presented at 2017 Southern California Big Data Discovery Summit, Azusa, CA, Nov, 4, 2017.

[48] R. Sturdivant, “Electronic packaging for 5G microwave and millimeter wave systems,” Professional Development Course at IEEE 19th Electronics Packaging Technology Conference, Singapore, Dec 6-9, 2017.

[49] R. Sturdivant, “Panel Session: Challenge Of 5-G mm-wave Packaging and Opportunity,” Panel Session Presentation at IEEE 19th Electronics Packaging Technology Conference, Singapore, Dec 6-9, 2017.

[50] R. Sturdivant, E. Chang, D. Bartholomew, R. Brown, S. De Pillis-Lindheim, J. Rohweller, “Systems Engineering a Low Cost Digital Beam Formed Phased Array for IoT Connectivity,” in Proceedings of the 2017 International Conference on Computational Science and Computational Intelligence, Las Vegas, USA, December 14-16, 2017.

[51] Rick L. Sturdivant, James Yeh, Mark Stambaugh, Alex Zahnd, Nicholas Villareal, Charles K. Vetter, Justin D. Rohweller, Jacob F. Martinez, Jordan M. Ishii, Ryan A. Brown, Aaron M. Arkie, “IoT enabled pico-hydro electric power with satellite back haul for remote Himalayan villages,” in Proceedings of Topical Workshop on Internet of Space (TWIOS), Jan 14-17, 2018, Anaheim, CA.

[52] R. Sturdivant, “Challenges and opportunities for the internet of space,” Presented at Microwaves, Cubesats, and Small Satellites Workshop at IEEE Radio and Wireless Week Conference, Anaheim, CA, Jan 15, 2018.

[53] R. Sturdivant, J. Lee, “Systems engineering of IoT connectivity in commerical airliners using satellite backhaul links,” in Proceedings of Topical Workshop on Internet of Space (TWIOS, Jan 14-17, 2018, Anaheim, CA.

[54] E. Chang, R. Sturdivant, B. Quilici, E. Patigler, “Micro and Mini Drone Classification Based on Coherent Radar Imaging,” in Proceedings of the IEEE Radio and Wireless Week Conference, Anaheim, CA, Jan 15, 2018.

[55] R. Sturdivant, “5G Systems and Packaging Opportunities,” Presented at 51st International Symposium on Microelectronics, Pasadena, CA, October 8-11, 2018.

[56] R. Sturdivant, “Electronic Packaging for 5G Microwave and Millimeter Wave Systems,” Professional Development Course at 51st International Symposium on Microelectronics, Pasadena, CA, October 8-11, 2018.

Thesis and Dissertation

[1] R. Sturdivant, “A Wide Band, Low Loss, Miniature Microwave Diplexer,” M.S. Thesis, Department of Electrical Engineering, Univeristy of California at Los Angeles, Los Angeles, CA, 1992.

[2] R. Sturdivant, “Application Of Systems Engineering To Complex Systems and Systems of Systems,” Ph.D. Dissertation, College of Engineering, Colorado State University, 2017.