Articles & Workshops

Journal Articles

[1] R. Sturdivant, T.A Midford, J.J. Wooldridge, “The evolution of packages for monolithic microwave and millimeter-wave circuits,” IEEE Transactions on Antennas and Propagation, Sept, 1995, pp. 983-991.

[2] C.P. Schaffer, I.C. Chen, R. Sturdivant, A.T. Hunter, R.G. Wilson, “Commercial CVD diamond films: Material properties and their related effects on microwave characteristics,” Diamond and Related Materials, vol. 7, Feb. 1998, pp. 585-588.

[3] V.K. Tripathi, R. Sturdivant, “Guest Editor,” IEEE Transactions on Microwave Theory and Techniques, vol. 45, 1997, pp. 1817-1818.

[4] R. Sturdivant, A.J. Bogdon, E.K.P. Chong, “A simple closed form solution to single layer heat spreading angle appropriate for microwave hybrid modules,” Journal of Electronics Cooling and Thermal Control, June 2016, no. 6, pp.52-61.

[5] R. Sturdivant and E. K. P. Chong, “Systems engineering of a terabit elliptic orbit satellite and phased array ground station for IoT connectivity and consumer Internet access,” IEEE Access, Vol. 4, Sept 13, 2016, pp. 9941-9957.

[6] R. Sturdivant, A. Bogdon, E.K.P. Chong, “Balancing Thermal and Electrical Packaging Requirements for GaN Microwave and Millimeter-Wave High Power Amplifier Modules” Journal of Electronics Cooling and Thermal Control, Vol. 7, No. 1, 2017, pp. 1-7.

[7] R. Sturdivant, E.K.P. Chong, “Systems Engineering Baseline Concept Of A MultiSpectral Drone Detection Solution For Airports,” IEEE Access, Vol. 5, April 25, 2017, pp. 2169-3536.

[8] R. Sturdivant and E. K. P. Chong, “The Necessary and Sufficient Conditions for Emergence in Systems Applied To Symbol Emergence in Robots,” IEEE Transactions on Cognitive and Developmental Systems, Vol. PP, No. 99, July 24, 2017.

[10] R. Sturdivant and E. K. P. Chong, “Packageability as an ‘Ility’ for Systems Engineering,” Systems, 5(4), 48, Sept 23, 2017.

Conference Articles and Other Presentations

[1] R. Sturdivant, “A Capacitively Coupled BPF Design Using a Suspended Substrate Stripline,” Microwave Journal, Nov. 1993, pp 71-74.

[2] R. Sturdivant, “Balun Designs for Wireless – Mixers, Amplifiers and Antennas,” Applied Microwave and Wireless, Summer 1993.

[3] R. Sturdivant, C. Quan, B. Young, “Using the matrix metal-on-elastomer connector at microwave frequencies.” in International Symposium on Microelectronics, 27 th, Boston, MA. 1994.

[4] R. Sturdivant, “Transmission line conductor loss and the incremental inductance rule,” Microwave Journal, Sept. 1995. (the copy I have of this article is very low quality so I included a copy of my original submission to the publisher which has better graphical quality though there are differences in the text due to editorial changes)

[5] R. Sturdivant, et. al., “Heat Dissipating Transmission Lines,” Applied Microwave & Wireless, Spring 1995, pp. 57-63.

[6] R. Sturdivant, “Millimeter-wave characterization of several substrate materials for automotive applications,” in Electrical Performance of Electronic Packaging, 1995, pp. 137-139.

[7] R. Sturdivant, “Reducing the effects of the mounting substrate on the performance of GaAs MMIC flip chips,” in IEEE MTT-S International Microwave Symposium Digest, 1995, pp. 1591-1595.

[8] R. Sturdivant, et. al., “Investigation of MMIC flip chips with sealants for improved reliability without hermeticity,” in Proceedings of IEEE MTT-S International Microwave Symposium Digest, 1996, pp. 239-242.

[9] R. Sturdivant,, et. al., “Transitions and interconnects using coplanar waveguide and other three conductor transmission lines,” in Proceedings of IEEE MTT-S International Microwave Symposium Digest, 1996, pp. 235-238.

[10] R. Sturdivant, et. al., “Using MMIC flip chips and CVD diamond for improved thermal management of microwave modules,” in Proceedings of IEEE MTT-S International Microwave Symposium Digest, 1997, pp. 505-507.

[11] R. Sturdivant, et. al., “Design and performance of a high density 3D microwave module,” in Proceedings of IEEE MTT-S International Microwave Symposium Digest, 1997, pp. 501-504.

[12] R. Sturdivant, “Leadless Chip Carrier for Microwave MEMS Packaging,” IMAPS 2006 International Conference and Exhibition on Device Packaging.

[13] R. Sturdivant, “Ceramic Microwave/Millimeter-Wave IC Packaging,” IMAPS 2006 International Conference and Exhibition on Device Packaging.

[14] R. Sturdivant, “Advanced Packaging,” Presentation at the Georgia Tech Research Institute Professional Education, Sept. 2012.

[15] R. Sturdivant,, “Module Packaging,” Presentation at the Georgia Tech Research Institute Professional Education, Sept. 2012.

[16] R. Sturdivant, “The Incompatibility of Emergent and Thomistic Views of the Soul,” (Student Paper) Presented at 59th Annual Midwest Regional Evangelical Theological Society Meeting, 2014.

[17] R. Sturdivant, E.K.P. Chong, “Systems engineering of hybrid renewable electric power,” in Proceedings of IEEE Green Technologies Conference (GreenTech), Kansas City, MO, April 2016.

[18] R. Sturdivant, E.K.P. Chong, “Systems engineering contributions to digital receivers for phased array radar,” in Proceedings of IEEE International Symposium on Phased Array Systems and Technology, Waltham, MA, Oct. 2016.

[19] R. Sturdivant, E.K.P. Chong, “Systems engineering of low cost AESAs for high volume consumer LEO satellite ground stations,” in Proceedings of Ka and Broadband Communications Conference, Cleveland, OH, Oct. 2016.

[20] R. Sturdivant, L. Miller, E.K.P. Chong, “Systems Engineering Of Digitally Beam Formed Electronically Scanned Phased Arrays for Terabit per Second Satellites,” in Proceedings of IEEE Topical Workshop On The Internet of Space (IoS), Phoenix, AZ, January 15-18, 2017.

[21] R. Sturdivant, E.K.P. Chong, “Dielectric Notch Radiator Antennas with Integrated Filtering For 5G and IoT Access,” in Proceedings of IEEE Radio and Wireless Symposium, Phoenix, AZ, January 15-18, 2017.

[22] R. Sturdivant, E.K.P. Chong, “System Latency Performance of Mechanical and Electronic Scanned Antennas for LEO Ground Stations for IoT and Internet Access,” in Proceedings of IEEE Topical Workshop On The Internet of Space (IoS), Phoenix, AZ, January 15-18, 2017.

[23] A. Zahnd, M. Stambaugh, D. Jackson, T. Gross, C. Hugi, R. Sturdivant, J. Yeh, S. Sharma, “Modular Pico-Hydro Power System for Remote Himalayan Villages,” Presented at World Renewable Energy Congress XVI, Feb 5-9, 2017.

[24] R. Sturdivant, J. Yeh, M. Stambaugh, A. Zahnd, E. K. P. Chong, “Pico-hydro electric power in the Nepal Himalayas,” in Proceedings of 9th IEEE Annual Green Technologies Conference (IEEE GreenTech 2017), Denver, Colorado, March 29–31, 2017.

[25] R. Sturdivant, “Investigation of Team Based Learning For Teaching General Education Astronomy,”Poster Session at Breaking The Boundaries In STEM Education Research Conference, Los Angeles, CA, April 7, 2017

[26] R. Sturdivant, “The Reflective Reciprocal Support Model for Integration of Science and Christianity,” Presented at 2017 Annual Day Conference—So. Cal. Christians in Science, Riverside, CA, April 8, 2017.

[27] R. Sturdivant, J. Yeh, M. Stambaugh, A. Zahnd, “Sustainability as a characterisitic of renewable energy systems in remote himalayan villages,” in Proceedings of the Solar World Congress, Abu Dhabi, UAE, Oct 29-Nov 2, 2017. (to appear)

[28] R. Sturdivant, “Electronic packaging for 5G microwave and millimeter wave systems,” Professional Development Course at IEEE 19th Electronics Packaging Technology Conference, Singapore, Dec 6-9, 2017. (to appear)

[29] Rick L. Sturdivant, James Yeh, Mark Stambaugh, Alex Zahnd, Nicholas Villareal, Charles K. Vetter, Justin D. Rohweller, Jacob F. Martinez, Jordan M. Ishii, Ryan A. Brown, Aaron M. Arkie, “IoT enabled pico-hydro electric power with satellite back haul for remote Himalayan villages,” Proceedings of the IEEE Radio and Wireless Conference, Topical Workshop On The Internet of Space, Jan 14-17, 2017, Anaheim, CA. (to appear)

[30] R. Sturdivant, R. Brown, J. Sturdivant, “Analysis of big data generated by internet of things (IoT) devices: A smart city sensor application,” 2017 Southern California Big Data Discovery Summit, Azusa, CA, Nov, 4, 2017. (to appear)

[31] R. Sturdivant, J. Lee, “Systems engineering of IoT connectivity in commerical airliners using satellite backhaul links,” Proceedings of the IEEE Radio and Wireless Conference, Topical Workshop On The Internet of Space, Jan 14-17, 2017, Anaheim, CA. (to appear)

Workshops And Other Presentations

[1] R. Sturdivant, “Packaging and Filters At Microwave Frequencies,” Presentation at Buenaventura IEEE Section Meeting, March 22, 1996.

[2] R. Sturdivant, G.E. Panchak, “PWB: Should I choose a ceramic or organic board?”, IEEE International Microwave Symposium, Fort Worth, TX, June 2004.

[3] R. Sturdivant, “WSJ Workshop Presentation: Ceramic Packaging Issues for Wireless High Power Amplifiers,” IEEE International Microwave Symposium, Fort Worth, TX, June 2004.

[4] R. Sturdivant, “Millimeter-wave Radio System In A Package,” IMAPS Advanced Technology Workshop on RF and Microwave Packaging, Sept. 2008.

[5] R. Sturdivant, “Design of Transmit/Receive Modules,” IMAPS Advanced Technology Workshop on RF and Microwave Packaging, Sept. 2009

[6] R. Sturdivant, “Materials and Transmission Line Measurements Comparing HTCC and Thick Film Alumina,” 2014 IMAPS RaMP Conference in San Diego, CA.

[7] R. Sturdivant, “Broadband Electrical Modeling of Transitions and Interconnects Useful for PCB and Co-fired Ceramic Packaging,” 2014 IMAPS RaMP Conference in San Diego, CA. (Won best session paper)

[8] R. Sturdivant, “How to Successfully Measure and Model Electronic Packages for SI,” WMJ Workshop IEEE MTT-S International Microwave Symposium, Phoenix, AZ, May 2015.

[9] R. Sturdivant, “Electronic Packaging at Microwave and Millimeter-wave Frequencies: Applications, Key Components, Design Issues,” IEEE CLASTECH Conference, Los Angeles, CA, November 2015.

[10] R. Sturdivant, E.K.P. Chong, “Modeling and Simulation of Via Conductor Losses in Co-fired Ceramic Substrates Used In Transmit Receive Radar Modules,” 2016 IMAPS RaMP Conference, San Diego, CA.

[11] R. Sturdivant and E. K. P. Chong, “Smart base stations for IoT,” presented at Cyber Cycles for the Internet of Things (IoT), workshop at 1st IEEE Conference on Control Technology and Applications (CCTA), Kohala Coast, Hawai’i, August 27–30, 2017.

[12] R. Sturdivant, “Panel Session: Challenge Of 5-G mm-wave Packaging and Opportunity,” Panel Session at IEEE 19th Electronics Packaging Technology Conference, Singapore, Dec 6-9, 2017. (to appear)

Thesis and Dissertation

[1] R. Sturdivant, “A Wide Band, Low Loss, Miniature Microwave Diplexer,” M.S. Thesis, Department of Electrical Engineering, Univeristy of California at Los Angeles, Los Angeles, CA, 1992.

[2] R. Sturdivant, “Application Of Systems Engineering To Complex Systems and Systems of Systems,” Ph.D. Dissertation, College of Engineering, Colorado State University, 2017.