One of the most exciting projects I have ever worked on was the development of the tile array module used in phased array radar[1,2]. I was awarded the Howard Hughes Engineering Excellence Award for my work on Tile Array Modules.
Figure 1 shows an image of a tile module. I was the technical lead module designer. I was directly responsible for all the electrical aspects and performed the vast majority of the modeling, testing and technology development required to realize it. I also was on the team that was responsible for the thermal and mechanical design. Fortunately, we had a very good thermal analyst and mechanical engineer on our team. This module achieved several world’s first:
1) World’s smallest volume T/R module for its rated output power (78% reduction)
2) World’s lowest volume four channel T/R module
3) World’s first T/R module to use compressible connectors
4) World’s first T/R module to use all Flip Chip GaAs MMICs
Figure 1. Photograph of a tile array module.
 R. Sturdivant, et. al., “Design and performance of a high density 3D microwave module,” IEEE MTT-S International Microwave Symposium Digest, 1997.
 R. Sturdivant, et. al., “The Evolution of Packages for Monolithic Microwave and Millimeter-wave Circuits,” IEEE Trans On Antennas and Prop, Sept 1995 pp. 983-991